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產(chǎn)品類(lèi)型 RAM容量 程序存儲器類(lèi)型 工作溫度 核心處理器 振蕩器型 周邊設備
篩選條件
512 x 8 ROMless -40°C ~ 85°C HC11 Internal POR, WDT
512 x 8 ROMless -40°C ~ 85°C HC11 Internal POR, WDT
512 x 8 ROMless -40°C ~ 85°C HC11 Internal POR, WDT
192 x 8 OTP -40°C ~ 85°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 85°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 85°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 85°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 85°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 85°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 85°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 125°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 125°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 125°C HC11 Internal POR, WDT
768 x 8 OTP -40°C ~ 105°C HC11 Internal POR, WDT
1K x 8 FLASH -40°C ~ 85°C HC08 Internal LVD, POR, PWM
1K x 8 FLASH -40°C ~ 125°C HC08 Internal LVD, POR, PWM
1K x 8 FLASH -40°C ~ 105°C HC08 Internal LVD, POR, PWM
1K x 8 FLASH -40°C ~ 85°C HC08 Internal LVD, POR, PWM
1K x 8 FLASH -40°C ~ 125°C HC08 Internal LVD, POR, PWM
1K x 8 FLASH -40°C ~ 105°C HC08 Internal LVD, POR, PWM